《手機(jī)開(kāi)發(fā)與設(shè)計(jì)流程詳解》由會(huì)員分享，可在線(xiàn)閱讀，更多相關(guān)《手機(jī)開(kāi)發(fā)與設(shè)計(jì)流程詳解（48頁(yè)珍藏版）》請(qǐng)?jiān)谘b配圖網(wǎng)上搜索。
1、Titelmasterformat durch Klicken bearbeiten,,Textmasterformate durch Klicken bearbeiten,,Zweite Ebene,,Dritte Ebene,,Vierte Ebene,,Fünfte Ebene,,,*,Titelmasterformat durch Klicken bearbeiten,,Textmasterformate durch Klicken bearbeiten,,Zweite Ebene,,Dritte Ebene,,Vierte Ebene,,Fünfte Ebene,,,*,EP,,He
2、ading Level One,,First line,,Second line,,Third line,,Fourth line,,Fifth line,,,,*,BenQ Confidential (yyyy/mm/dd),?,2005, BenQ Corporation,First line,,Second line,,Third line,,Fourth line,,Fifth line,,,,*,BenQ Confidential (03/01/2006),?,2006, BenQ Corporation,,STRICTLY CONFIDENTIAL,Click to edit Ma
3、ster title style,,First line,,Second line,,Third line,,Fourth line,,Fifth line,,,,*,BenQ Confidential (03/01/2006),?,2006, BenQ Corporation,,STRICTLY CONFIDENTIAL,Click to edit Master title style,,按一下以編輯母片標(biāo)題樣式,,按一下以編輯母片,,第二層,,第三層,,第四層,,第五層,,BenQ,Confidential (2005/07/01),?,2005, BenQ Corporation,按一下
4、以編輯母片標(biāo)題樣式,,按一下以編輯母片,,第二層,,第三層,,第四層,,第五層,,BenQ,Confidential (2005/07/01),?,2005, BenQ Corporation,First line,,Second line,,Third line,,Fourth line,,Fifth line,,,,*,BenQ Confidential (03/01/2006),?,2006, BenQ Corporation,,Click to edit Master title style,,First line,,Second line,,Third line,,Fourth li
5、ne,,Fifth line,,,,*,BenQ Confidential (03/01/2006),?,2006, BenQ Corporation,,Click to edit Master title style,,Heading Level One,,First line,,Second line,,Third line,,Fourth line,,Fifth line,,,,*,,手機(jī)產(chǎn)品設(shè)計(jì)與開(kāi)發(fā),,,明基電通,,移動(dòng)通,[,訊事業(yè)群 專(zhuān)案管理部,,產(chǎn)品經(jīng)理,,邱珮瑜,Polly Chiu,2006/12/26,Topic,個(gè)人簡(jiǎn)介,,明基,BenQ,簡(jiǎn)介,,產(chǎn)品開(kāi)發(fā)流程,,手機(jī)
6、開(kāi)發(fā)功能區(qū)塊,,手機(jī)系統(tǒng)演進(jìn),,3G,介紹,,手機(jī)功能發(fā)展趨勢(shì),,無(wú)線(xiàn)通信發(fā)展趨勢(shì),,,個(gè)人簡(jiǎn)介,,個(gè)人簡(jiǎn)介,2000,年畢業(yè)於中山大學(xué)物理研究所,,2001.04~2006.03:,明基儲(chǔ)存事業(yè)部研發(fā)處研發(fā)部,,Team Leader of Write Strategy Team / Firmware R&D,,Slim DVD+-R(RW)(12x)/DVD+-R(RW)(4x,8x,16x)/CDR(RW)(32x,40x,48x) drive development,,團(tuán)隊(duì)發(fā)表世界第一的,4x, 8x, DL, 16x DVD,燒錄機(jī),,IEEE,論文發(fā)表,,發(fā)表,4,篇專(zhuān)利,,20
7、06.03~2006.12:,明基移動(dòng)通訊事業(yè)群專(zhuān)案管理部,,技術(shù)產(chǎn)品經(jīng)理,-,目前負(fù)責(zé),3.5G HSDPA feature phone project,明基,BenQ,簡(jiǎn)介,-,享受快樂(lè)科技,,數(shù)位時(shí)尚品牌,3C,數(shù)位整合 國(guó)際級(jí)設(shè)計(jì)實(shí)力,1984,年成立,,企業(yè)願(yuàn)景,:,傳達(dá)資訊生活的真善美,,1996,年股票在臺(tái)灣上市,,2001,年,BenQ,品牌誕生,,2005,年?duì)I收,:,,明基電通,:,新臺(tái)幣,1,623,億元,,明基集團(tuán),:,新臺(tái)幣,3,979,億元,,全球員工人數(shù),(2006/10),,明基電通,: 13,000+,人,,明基集團(tuán),: 68,000+,人,,「量做精品」,:
8、,量身訂做讓消費(fèi)者生活,,充滿(mǎn)樂(lè)趣的網(wǎng)絡(luò)時(shí)尚產(chǎn)品,,獨(dú)特,3C,產(chǎn)品組合：將數(shù)位產(chǎn)品整合成符合未來(lái)消費(fèi)者生活型態(tài)的數(shù)位中樞 一,,筆記型電腦、手機(jī)、數(shù)位電視,享受快樂(lè)科技之企業(yè),化企業(yè)願(yuàn)景為品牌使命,,1992,2002,,明基集團(tuán)企業(yè)願(yuàn)景,156,263,269,52,68,3,11,26,416,284,624,351,737,1,047,1,650,1,623,1,208,284,777,427,1,100,2,347,381,1,875,3,648,3,979,BenQ,Group,BenQ,,Corp.,單位,:,億元,(,新臺(tái)幣,),,,,,,,Phase 1,,,1984-199
9、1,,OEM,,,,,,,強(qiáng)大的,,生產(chǎn)製造能力,,,,從製造代工到深耕技術(shù)與設(shè)計(jì)之品牌,Phase 2,,,1991-2001,,From OEM to ODM,,,,,,,多元化的技術(shù)投資,,“水平整合,+,專(zhuān)業(yè)分工”,,,Phase 3,,,2001-2006,,From ODM to Branded Business,,,,,,數(shù)位時(shí)尚品牌,,3C,數(shù)位整合,,國(guó)際級(jí)設(shè)計(jì)實(shí)力,,單位,:,億元,(,新臺(tái)幣,),三大事業(yè)群,明基電通,移動(dòng)通信,,事業(yè)群,,(MCG),數(shù)位媒體,,事業(yè)群,,(DMG),整合製造服務(wù),,事業(yè)群,(IMS),洞悉數(shù)位市場(chǎng) 掌握絕對(duì)優(yōu)勢(shì),獨(dú)特,5C,策略 強(qiáng)
10、化競(jìng)爭(zhēng)優(yōu)勢(shì),電子商品整合趨勢(shì)贏家,Computing,,資訊產(chǎn)品,,個(gè)人電腦,,,液晶顯示器,,,,電腦週邊,,Consumer Electronics,,數(shù)位媒體產(chǎn)品,,數(shù)位投影機(jī),,,液晶電視,,,,個(gè)人無(wú)線(xiàn)影音,,,,,數(shù)位相機(jī),,,車(chē)用顯示器,Mobile Communications,,移動(dòng)通信產(chǎn)品,,行動(dòng)電話(huà),產(chǎn)品開(kāi)發(fā)流程,產(chǎn)品開(kāi)發(fā)流程,Proposal,構(gòu)想階段,,Plan,評(píng)估規(guī)劃階段,,Design,設(shè)計(jì)階段,,Execute,研發(fā)執(zhí)行階段,,Mass production,生產(chǎn)階段,,Close,結(jié)束階段,,,,,,C System,,C1,Planning,,Phase,
11、,,C2,R&D Design,,Phase,,,C3,Lab Pilot,,Run Phase,,,C4,ENG Pilot,,Run Phase,,,C5,PD Pilot,,Run Phase,,Mass,,Production,,Phase,,,C6,,C0,Proposal,,Phase,,,Planning-PM,,,Manufacture,,-Factory,Design-RD,,,Product definition,,Feasibility analysis,,ID initiation,Organize Project team member,,Project schedu
12、le,HW/SW design,HW/SW design lock down,,HW/SW design approved,Verification of Product maturity verification,,Production line set up,Verification of production line maturity /stability,,Product design finalized,Mass production,DVT Phase,MVT Phase,QVT Phase,,,,DVT : Design Verification Testing,,MVT:
13、 Manufacture Verification Testing,,QVT : Quality Verification Testing,,,,,,,,LPR: Laboratory Pilot Run,,EPR: Engineering Pilot Run,,PPR: Production Pilot Run,,MP: Mass Production,Mobile development function Introduction,Mobile development function,外觀設(shè)計(jì),(ID),Industry Design,,機(jī)構(gòu)設(shè)計(jì),(MD),Material Design
14、,,硬體設(shè)計(jì),(HW) Hard Ware,,BB (Base Band,基頻,),,RF (Radio Frequency,射頻,),,Antenna (,天線(xiàn),),,軟體設(shè)計(jì),(SW) Soft Ware,,MMI (Man Machine Interface,人機(jī)介面,),,Protocol,,Driver,Functional Architecture of Mobile Today,Feature List-HW,[Camera ],,Sony 2.0 Mega Pixel CMOS Auto Focus camera,,[Strobe],,LED flash light,,[Dis
15、play],,AUO 2.0” AMOLED 176x220 Pixels , 262K colors,,[Memory],,NOR Flash: 128Mbit, PSRAM: 64Mbit, NAND: 256Mbit,,SDRAM : 128Mbit,,[External Memory],,T-Flash,,[I/O],,DC Jack , 10 pin I/O,,[Connectivity],,USB1.1 , Bluetooth,ID,Vol. Up / Vol. Down,2 Segment Shutter Key,,,Mode Switch Key,,10 Pin I/O,,DC
16、 Jack,,,Microphone,Receiver,,T-Flash Card,,MD : Appearance treatment description,A,鋁板陽(yáng)極,+,噴砂,B,塑膠射出,+,噴漆,C,塑膠射出,+,噴漆,D,塑膠射出,+,噴漆,E,平板背印,F,P+R,噴塗雷雕,G,,H,雙料射出,+,噴漆,I,RUBBER,J,電鍍,K,電鍍,L,玻璃背印,M,塑膠射出,+,背印,N,銘版髮絲處理,P,,Q,噴漆,Exploded drawing,1,2,3,5,8,10,7,9,6,11,12,4,15,13,14,17,16,Front case assy.,,Keypad
17、 assy.,,Main lens,,Joystick cap,,OLED module,,Receiver,,Keypad FPC,,Main PCB assy.,,DSC module,,DSC FPC,,DSC holder,,Speaker,,Vibrator,,Rear case assy.,,Antenna cover,,Battery cover.,,Battery pack.,Placement description - I,Shielding case 1 -BB,Shielding case 2 -BB,T-flash connector,,(push-push type
18、),Pogo pin (for ESD),Back-up battery,,(Capacitor),30pin BTB Conn.,,(for DSC module),Joystick,,(Mitsumi),SMT-type MIC,Placement description - II,I/O connector,Battery connector,Mode switch,BT antenna switch,DC jack,Antenna connector,Antenna switch,Side-key (Vol-key),RF shielding case,10 pin Conn.,,(S
19、pk. and flash),LCM connector,BB shielding case,SIM connector,Key FPC connector,HW Block Diagram-2G,,Placement (Top Side),,Antenna,RF Area,,10 Pin I/O,Battery Connector,,,,IOTA,SIM Connector,G2,3 Combo,,Memory,,,,,LCDM Connector,,Keypad Connector,,BT Area,,DC Jack,Placement (Bottom Side),Audio CODEC,
20、,,MMP,MIC.,,,T Flash Connector,,OLED Limit Area,,Level Shifter,Camera Connector,,,Receiver,,Charging IC,Power IC,,Antenna,SW Feature Review,Band,Tri-band GSM/GPRS 900/1800/1900, GPRS Class 10,,Tri-band GSM/GPRS 850/1800/1900, GPRS Class 10,Speech Codec,FR/EFR/HF/AMR,Embedded DSC,2.0 Mega Pixel CMOS
21、sensor with Auto Focus + LED flash light,Memory,RSS 3 combo: NOR flash: 128Mb, Pseudo SRAM: 64Mb, Super-AND: 256Mb, SDRAM: SH-Mobile J2 embedded 128Mb,Connectivity,USB 1.1 (MSC, CDC, Pict-Bridge), Bluetooth (A2DP, HS/HF, BIP, OPP, DUN),Java,MIDP 2.0, CLDC1.1, JTWI,MP3, Melody,MP3/AAC(3D, EQ)/AAC+, S
22、W-MIDI,Voice recording,,AMR,Video recording/playing,,MP4, 3GP, H.263,DRM,OMA DRM 1.0,SW,Architecture-2G,,Tool,MMI,XPI ( Extend Programming Interface),Layer-1 / Driver,Service,,Display,,Input,,Menu,,PPF,,…,AP,,Camera,,MP3,,PIM,,Tool,,…,Protocol,,CC,,WAP,,STK,,Java,,…,Message,,SMS,,EMS,,MMS,,Email,,…,
23、PS ( Protocol Stack),OS,,,,,,手機(jī)系統(tǒng)演進(jìn),3G Evolution Overview,Analog,cdmaOne,,[US],GSM [Europe],TDMA [US],PDC [JP],GPRS,EDGE,WCDMA,,(UMTS, ULTRA FDD),HSDPA,cdma 2000,cdma2000,,(1xEVDO),cdma2000,,(1xEVDV),TD-SCDMA,,[China],1G,2G,2.5G,3G,3.5G,3G introduction,,,RF chipset,BB chipset,,Power Mgmt IC,3G Mobil
24、e HW,Sirius BREW-3G,,,,,,Applications,Device driver,Services,,BREW OEM,,BREW,,Extensions,,,BREW,,,,3G,手機(jī)單晶片趨勢(shì),多模式應(yīng)用,WEDGE,晶片,( WCDMA+EDGE),,支援,WCDMA,、,EDGE,、,GPRS,、,GSM,和,HSDPA,標(biāo)準(zhǔn),,可以在,2G,和,3G,網(wǎng)路間切換（,roaming,）,,以,CMOS,製程應(yīng)用,,,達(dá)到低成本減少零組件數(shù)、縮小尺寸、降低功耗，及提高效能等,3G -->3.5G,HSDPA,網(wǎng)路陸續(xù)開(kāi)通,,3G,升級(jí)到,3.5G,，不需再進(jìn)行基地臺(tái)
25、建設(shè)，只需軟體升級(jí),,3.5G,網(wǎng)路的下載傳輸速率已達(dá),3.6Mbps,(,比,3G,快,9,倍,,,甚至高於一般家用的,2M,ADSL),,2010,年預(yù)計(jì),行動(dòng)數(shù)據(jù)服務(wù),將會(huì)超越,行動(dòng)語(yǔ)音服務(wù),，為手機(jī)系統(tǒng)業(yè)者最重要的收入來(lái)源,,預(yù)計(jì)全球,3.5G,用戶(hù)數(shù)將從,250,萬(wàn)個(gè),(2006,年,),，成長(zhǎng)到,3,億,個(gè),(2011,年,),,,臺(tái)灣業(yè)者,,中華電信,:,採(cǎi)諾基亞的系統(tǒng),,,只開(kāi)通支援,1.8Mbps,的,HSDPA,網(wǎng)路服務(wù),,遠(yuǎn)傳電信,:,採(cǎi)易利信的系統(tǒng),,,推廣傳輸速率高達(dá),3.6Mbps,的,HSDPA,網(wǎng)路,,支援,3.6Mbps,的手機(jī)尚未到位，只能以,3.5G,數(shù)據(jù)
26、網(wǎng)卡先行,,困難,–,2007,年會(huì)大幅改善,,網(wǎng)路涵蓋率不足,,3.5G,手機(jī)選擇少,,,價(jià)格高,手機(jī)功能發(fā)展趨勢(shì),-,高整合化,重外觀設(shè)計(jì),,個(gè)人化,,多媒體,,多用途,手機(jī)功能發(fā)展趨勢(shì),-,整合通訊,(Voice),，資訊,(Data),，傳播,(Video),和無(wú)線(xiàn),(Wireless),,現(xiàn)有功能,,Mobile/Music/Video/Camera/Recorder/Game,,Storage Memory/FM radio/Application/Brower/High data rate/Connectivity : E-mail, BT, USB, IrDA/Light/In
27、dicator/ Voice recognition,,GPS/A-GPS ->,定位導(dǎo)航,/LBS,位置資訊服務(wù)（,Location Based Services,）,,TV-Out,,2D Bar code/QR Code,,新功能發(fā)展,,數(shù)位電視,DVB-H /,廣播,,Finger Printer,,電子錢(qián)包,:NFC,近距離無(wú)線(xiàn)傳輸（,Near Field Communication, NFC,）,,Projector,,手機(jī)投影,無(wú)線(xiàn)通信發(fā)展趨勢(shì),無(wú)線(xiàn)通信發(fā)展趨勢(shì),Functional Architecture of Mobile Tomorrow,FMC ( Fixed-Mob
28、ile Convergence),固網(wǎng)行動(dòng)聚合,固網(wǎng)和行動(dòng)網(wǎng)融合,: FMC,（,Fixed-Mobile Convergence)-,無(wú)縫隙不間斷的通訊品質(zhì),,由各種裝置、服務(wù)、網(wǎng)路，以及技術(shù)所融合而成,What’s IMS?,What’s IMS?,UMA-Unlicensed Mobile Access,提出一套解決方案，讓使用授權(quán)頻段的,GSM,和,GPRS,和使用無(wú)需授權(quán)頻段的,Bluetooth,和,802.11,彼此間能夠互相漫遊,,可用單一手機(jī)享受雙網(wǎng)合一的優(yōu)勢(shì)，甚至兼具節(jié)省話(huà)費(fèi)的好處。,UMA,（,Unlicensed Mobile Access,）,,對(duì)用戶(hù)來(lái)說(shuō)，採(cǎi)用,UMA,的技術(shù)後，在手機(jī)網(wǎng)路和,WiFi,或,Bluetooth,網(wǎng)路之間的切換是由系統(tǒng)來(lái)完成的，用戶(hù)一點(diǎn)感覺(jué)都沒(méi)有,Question?,
手機(jī)開(kāi)發(fā)與設(shè)計(jì)流程詳解
